ARES Consortium acts as both prime contractor in R&D programs and partner in industrial projects.
The main R&D areas are relevant to space systems and technologies and related ground applications.
The merge of University SME and large company components allows to exploit the necessary synergies to respond, in integrated manner, to the new competitive scientific and technological challenges, within both domestic and international areas.
The effective response to such challenges is based on three basic elements:
- Innovation capability
- Enabling technology development
- Multidisciplinary Approach
that constitute the main ARES assets enabling the conduction in space research activities.
- Integrated Solutions
- Innovative Technologies Introduction
- Feasibility and Analysis
- Program/Project Management
- Contractual Management
- Mission Definition and Analysis
- Mission Simulation
- Ground Segment Definition
- Validation and Verification
- SW Requirement, Design, Architecture
- Logistics Engineering
PAYLOAD, EQUIPMENT, STRUCTURES
- Design and Simulation
- TLC, Earth Observation, Navigation P/L’s
- Micro & Nanotechnologies
- Microwave Electronics
- Device Modelization
- Innovative Materials
FORMATION AND TRAINING
- Engineering / Technologies
- Didactic Programs
The Consortium two-fold components, University and Industrial, allow a global approach to satellite system and its applications. In ARES, innovation capability and research merge with industrial experience to provide effective solutions.
The Consortium is backed by solid competences able to conceive and design new missions and sophisticated space systems. Such competences are shared in large projects with scientific and/or industrial partnerships.
Application fields and relevant experience comprehend as follows:
Samples are represented by programs such as DAVID and WAVE (Italian Space Agency contracts) for experimentation of high frequency communication and in particular in W band (75-110 GHz).
In the frame of Remote Sensing, ARES is conducting research activities of the new technologies applications at very high frequency related to the Earth Observation and Deep Space exploration. In particular TECS can deploy a huge experience in such areas based on the more than twenty year experience of their technical staff. They have participated in programs such as Euclid Cepa 9, Envisat, Cosmo Skymed, RapidEye, TELAER, ARCHEO, Helios, etc. and in the implementations of the related facilities.
Multi-disciplinary competences allow to face the complex issues relative, where localization and positioning elements integrate with Telecommunication and Remote Sensing. In such a frame it is to mention PISTA project, integrated navigation inertial/GPS system, ICONA, COMs/NAV integrated project, participation to Galileo Test Range.
High Frequency Electronics
- Characterization, linear and not linear and noise modellization, for GaAs, InP, SiC e GaN transistors and passive devices.
- Analysis and Design of integrated subsystems such as low noise power amplifiers, transimpedance, impulse, distributed, mixer e frequency multipliers active and passive, control components (phase shifters and controlled attenuators). Multifunctional Integration.
- Characterization and component test both connectorized and ‘on wafer’ in the frequency range 0.045 – 110 GHz, via measurements in continuous, impulse, low signal, noise, and high signal at single/double tone for characterization device and subsystem linearity.
Electronic Devices and optoelectronic plastics.
Nanovalves for millimeter frequency and sub millimeter (up to 2 THz).
Nanotubes for composite structures, thermal dissipation (running projects), chemical e biological sensors (developed and running with Finmeccanica companies).
- Material Plastic Deformation Analysis.
- Impact (Crash) Analysis.
- Stratified Composite Materials Design.
- Mechanical Characterization of Electronic Structures.
- Braking Control (railway field – developed with SAB WABCO company).
- Fracture Mechanics (partnership: CSM and BP).
- Composite shape-memory Materials.
ARES are conducting research activities on multifunctional structures, that integrate electronic components, connections and power distribution together with thermal control and support mechanical structures. By nanotubes, hjghly resilient structures and thermal and electrical conductors can be realized. Bus based on electrical-optical technology can allow a data exchange at very high speed within the satellite or aircraft with a minimal weight and consumption increase.